Technology Commercialisation Opportunity
Reference No.
:
IHPC/02/TO/0028
Category
:
Lead-free solder alloy compositions.
Title
:
Tin-rich lead-free solder composition.
Abstract
:
Lead-free solder alloys based on 2 tin-rich alloys are disclosed. Both alloys have a melting temperature close to 183 0C and similar surface tension to that of Sn-Pb solder, and can thus be a readily substitute for conventional 60Sn-37Pb solder.
Potential Applications
:
The present invention can be applied in SMT technology.
Advantages
:
-
The alloys approaches conventional lead solders in performance of the Sn-Pb solder such as melting temperature and surface tension, and are free of Pb.
-
The alloys exhibit favorable mechanical properties.
-
The alloys in this invention have components of less than four.
Commercialisation
Opportunities
:
-
Ideally suited for an organisation having an established background in manufacturing and after-market support.
-
Technology is available for licensing from Exploit Technologies Pte Ltd.
-
Interested companies are invited to submit their plans to exploit the technology locally. All proposals are to be submitted to Exploit Technologies Pte Ltd.
Contact Us
:
Exploit Technologies
Private Limited
(A member of A*STAR)
10 Science Park Road #02-08
Singapore Science Park II
Singapore 117684
Email: tech-offer@exploit-tech.com
Disclaimer
Although due care and attention have been taken to ensure that the preparation of this material is as accurate as possible, the contents of this brochure are provided for information purposes only. Neither the Agency for Science, Technology and Research, Exploit Technologies Pte Ltd nor the inventors offer any warranty, written express or implied, as to the accuracy of the said contents. Applicants are advised to undertake independent evaluation of the technology